CVE record · CVE-2026-21372

Heap-Based Buffer Overflow in Power Management IC

CVSS 7.8 HighEPSS 0.0010 · 1st percentile

Published by the CVE Program (CNA: qualcomm) at 6 Apr 2026, 15:33 UTC. agentprime has not analysed this yet, so whether it affects any app is not known. This CVE names a vendor and product rather than a package, so the lockfile check doesn’t match it.

Affected products, as the CNA wrote them
Vendor	Product	Versions
Qualcomm, Inc.	Snapdragon	affected Cologne affected FastConnect 6700 affected FastConnect 6900 affected FastConnect 7800 affected QCM5430 affected QCM6490 affected Qualcomm Video Collaboration VC3 Platform affected Snapdragon 460 Mobile Platform affected Snapdragon 662 Mobile Platform affected Snapdragon 7c+ Gen 3 Compute affected WCD9370 affected WCD9375 and 16 more Other versions: unaffected

Identifiers: CVE-2026-21372
CNA: qualcomm
Weakness (CWE): CWE-122
Tags: Qualcomm, Inc. Snapdragon
Memory corruption
Published: 6 Apr 2026
Updated: 7 Apr 2026

Not analysed yet

We haven’t published our own analysis of this CVE. If a person reviews it, this page will say what’s affected and what has to be true for it to matter.

Severity and exploitation

Score	Rating	CVSS	Vector	Source
7.8	High	3.1	CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H	CNA (qualcomm)

CISA KEV Not listed.
EPSS 0.0010, the 1st percentile, on 5 Nov 2026: FIRST’s estimate of the chance of exploitation in the next 30 days.

Timeline

This record came from the full history of the CVE Program, published 6 Apr 2026. New records show when each source confirmed them.

Sources

References from the CNA

docs.qualcomm.com/product/publicresources/securitybulletin/april-2026-bulletin.html

Facts on this page come from the CVE List as the CNA published them, with CVSS from the sources named above, CISA KEV and FIRST EPSS. Vendors, products and versions are shown as the CNA wrote them. We don’t reproduce the CVE’s description.