CVE record · CVE-2023-28577

Multiple Dmabuf Kernel Address UAF Vulnerability

CVSS 6.7 MediumEPSS 0.0012 · 1st percentile

Published by the CVE Program (CNA: qualcomm) at 8 Aug 2023, 09:15 UTC. agentprime has not analysed this yet, so whether it affects any app is not known. This CVE names a vendor and product rather than a package, so the lockfile check doesn’t match it.

Affected products, as the CNA wrote them
Vendor	Product	Versions
Qualcomm, Inc.	Snapdragon	affected FastConnect 6800 affected FastConnect 6900 affected FastConnect 7800 affected QCA6391 affected QCA6426 affected QCA6436 affected QCN9074 affected QCS410 affected QCS610 affected SD865 5G affected Snapdragon 8 Gen 1 Mobile Platform affected Snapdragon 865 5G Mobile Platform and 19 more Other versions: unaffected

Identifiers: CVE-2023-28577
CNA: qualcomm
Weakness (CWE): CWE-416
Tags: Qualcomm, Inc. Snapdragon
Memory corruption
Published: 8 Aug 2023
Updated: 2 Aug 2024

Not analysed yet

We haven’t published our own analysis of this CVE. If a person reviews it, this page will say what’s affected and what has to be true for it to matter.

Severity and exploitation

Score	Rating	CVSS	Vector	Source
6.7	Medium	3.1	CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H	CNA (qualcomm)

CISA KEV Not listed.
EPSS 0.0012, the 1st percentile, on 10 Nov 2026: FIRST’s estimate of the chance of exploitation in the next 30 days.

Timeline

This record came from the full history of the CVE Program, published 8 Aug 2023. New records show when each source confirmed them.

Sources

References from the CNA

www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin

Facts on this page come from the CVE List as the CNA published them, with CVSS from the sources named above, CISA KEV and FIRST EPSS. Vendors, products and versions are shown as the CNA wrote them. We don’t reproduce the CVE’s description.